Acronyms and abbreviations

3DS TSV: three-dimensional stacked through-silicon via (integrated circuit packaging technology)

AHCI: advanced host controller interface

AHS: Active Health System

API: application program interface

CAS: column address strobe

CMA: cable management arm

CSR: customer self repair

DDR4: double data rate-4

FCoE: Fibre Channel over Ethernet

GPU: graphics processing unit

HPE SSA: HPE Smart Storage Administrator

IEC: International Electrotechnical Commission

iLO: Integrated Lights-Out

IML: Integrated Management Log

ISO: International Organization for Standardization

LFF: large form factor

LRDIMM: load reduced dual in-line memory module

LTO: linear tape-open

NFV: network functions virtualization

NVMe: nonvolatile memory express

PCA: printed circuit assembly

PCIe: Peripheral Component Interconnect Express

PDB: power distribution board

POST: Power-On Self-Test

PXE: Preboot eXecution Environment

QR code: quick response code

RBSU: ROM-Based Setup Utility

RDIMM: registered dual in-line memory module

REACH: Registration, Evaluation, Authorization, Restriction of Chemicals (European Union chemical regulatory framework)

REST: Representational State Transfer

RoHS: Restriction of Hazardous Substances

SAS: serial attached SCSI

SATA: serial ATA

SD: secure digital

SFF: small form factor

SMB: small and medium business

SPP: Service Pack for ProLiant

SSD: solid state device

StorCLI: Storage Command Line Interface

TPM: Trusted Platform Module

UDIMM: unregistered dual in-line memory module

UEFI: Unified Extensible Firmware Interface

UID: unit identification

UPS: uninterruptible power supply

VM: virtual machine