Ethernet and InfiniBand adapters

Description Chassis Fan configuration Number of drives supported by the server Maximum inlet ambient temperature
Ethernet adapters with SFP+, SFP28 or QSFP transceivers/InfiniBand adapters with QDR or FDR speed Apollo r2200 Gen10 Chassis

(12 LFF backplane)

Redundant and nonredundant 5 to 6 drives1

Optical cable:

Not supported

Copper cable:

25°C (77°F)

5 to 6 drives2

Not supported

0 to 4 drives3

Optical cable:

22°C (71.6°F)

Copper cable:

30°C (86°F)

Apollo r2600 Gen10 Chassis

(24 SFF or 16 SFF + 8 NVMe backplane)

Redundant and nonredundant 0 to 10 drives

Optical cable:

Not supported

Copper cable:

30°C (86°F)

Apollo r2800 Gen10 Chassis

(24 SFF backplane with SAS expander)

Redundant and nonredundant 0 to 24 drives

Optical cable:

Not supported

Copper cable:

30°C (86°F)

Apollo r2800 Gen10 Chassis

(16 NVMe backplane)

Redundant and nonredundant 0 to 8 drives

Optical cable:

Not supported

Copper cable:

30°C (86°F)

Ethernet adapters with QSFP28 transceiver/InfiniBand adapters with EDR speed Apollo r2200 Gen10 Chassis

(12 LFF backplane)

Redundant and nonredundant 5 to 6 drives1

Optical cable:

Not supported

Copper cable:

25°C (77°F)

5 to 6 drives2

Not supported

0 to 4 drives3

Optical cable:

22°C (71.6°F)

Copper cable:

30°C (86°F)

Apollo r2600 Gen10 Chassis

(24 SFF or 16 SFF + 8 NVMe backplane)

Redundant and nonredundant 0 to 10 drives

Optical cable:

Not supported

Copper cable:

30°C (86°F)

Apollo r2800 Gen10 Chassis

(24 SFF backplane with SAS expander)

Redundant and nonredundant 0 to 24 drives

Optical cable:

Not supported

Copper cable:

30°C (86°F)

Apollo r2800 Gen10 Chassis

(16 NVMe backplane)

Redundant and nonredundant 0 to 8 drives

Optical cable:

Not supported

Copper cable:

30°C (86°F)

IB HDR100/EN 100 GB 1P 940QSFP56 Apollo r2200 Gen10 Chassis

(12 LFF backplane)

Redundant and nonredundant 5 to 6 drives1

Not supported

5 to 6 drives2

Not supported

0 to 4 drives3

Not supported

0 to 3 drives4

Optical cable:

30°C (86°F)

Copper cable:

35°C (95°F)

IB HDR100/EN 100 GB 1P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) Apollo r2200 Gen10 Chassis

(12 LFF backplane)

Redundant and nonredundant 0 to 3 drives4

Optical cable:

28°C (82.4°F)

Copper cable:

35°C (95°F)

IB HDR100/EN 100 GB 1P 940QSFP56 Apollo r2600 Gen10 Chassis

(24 SFF or 16 SFF + 8 NVMe backplane)

Redundant and nonredundant 0 to 10 drives

Not supported

0 to 6 drives5

Optical cable:

25°C (77°F)

Copper cable:

30°C (86°F)

IB HDR100/EN 100 GB 1P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) Apollo r2600 Gen10 Chassis

(24 SFF or 16 SFF + 8 NVMe backplane)

Redundant and nonredundant 0 to 6 drives5

Optical cable:

22°C (71.6°F)

Copper cable:

30°C (86°F)

IB HDR100/EN 100 GB 1P 940QSFP56 Apollo r2800 Gen10 Chassis

(24 SFF backplane with SAS expander)

Redundant and nonredundant 0 to 24 drives

Not supported

Apollo r2800 Gen10 Chassis

(16 NVMe backplane)

Redundant and nonredundant 0 to 8 drives

Not supported

0 to 4 drives6

Not supported

0 to 2 drives7

Optical cable:

22°C (71.6°F)

Copper cable:

25°C (77°F)

IB HDR100/EN 100 GB 2P 940QSFP56 Apollo r2200 Gen10 Chassis

(12 LFF backplane)

Redundant and nonredundant 5 to 6 drives1

Not supported

5 to 6 drives2

Not supported

0 to 4 drives3

Not supported

0 to 3 drives4

Optical cable:

28°C (82.4°F)

Copper cable:

35°C (95°F)

IB HDR100/EN 100 GB 2P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) Apollo r2200 Gen10 Chassis

(12 LFF backplane)

Redundant and nonredundant 0 to 3 drives4

Optical cable:

25°C (77°F)

Copper cable:

35°C (95°F)

IB HDR100/EN 100 GB 2P 940QSFP56 Apollo r2600 Gen10 Chassis

(24 SFF or 16 SFF + 8 NVMe backplane)

Redundant and nonredundant 0 to 10 drives

Not supported

0 to 6 drives5

Optical cable:

22°C (71.6°F)

Copper cable:

35°C (95°F)

IB HDR100/EN 100 GB 2P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) Apollo r2600 Gen10 Chassis

(24 SFF or 16 SFF + 8 NVMe backplane)

Redundant and nonredundant 0 to 6 drives5

Optical cable:

22°C (71.6°F)

Copper cable:

30°C (86°F)

IB HDR100/EN 100 GB 2P 940QSFP56 Apollo r2800 Gen10 Chassis

(24 SFF backplane with SAS expander)

Redundant and nonredundant 0 to 24 drives

Not supported

Apollo r2800 Gen10 Chassis

(16 NVMe backplane)

Redundant and nonredundant 0 to 8 drives

Not supported

0 to 4 drives6

Not supported

Nonredundant 0 to 2 drives7

Optical cable:

Not supported

Copper cable:

30°C (86°F)

Redundant

Optical cable:

22°C (71.6°F)

Copper cable:

30°C (86°F)

IB HDR/EN 200 GB 1P 940QSFP56 Apollo r2200 Gen10 Chassis

(12 LFF backplane)

Redundant and nonredundant 5 to 6 drives1

Not supported

5 to 6 drives2

Not supported

0 to 4 drives3

Not supported

0 to 3 drives4

Optical cable:

28°C (82.4°F)

Copper cable:

28°C (82.4°F)

IB HDR/EN 200 GB 1P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) Apollo r2200 Gen10 Chassis

(12 LFF backplane)

Redundant and nonredundant 0 to 3 drives4

Optical cable:

25°C (77°F)

Copper cable:

25°C (77°F)

IB HDR/EN 200 GB 1P 940QSFP56 Apollo r2600 Gen10 Chassis

(24 SFF or 16 SFF + 8 NVMe backplane)

Redundant and nonredundant 0 to 10 drives

Not supported

0 to 6 drives5

Not supported

Apollo r2800 Gen10 Chassis

(24 SFF backplane with SAS expander)

Redundant and nonredundant 0 to 24 drives

Not supported

Apollo r2800 Gen10 Chassis

(16 NVMe backplane)

Redundant and nonredundant 0 to 8 drives

Not supported

0 to 4 drives6

Not supported

Nonredundant 0 to 2 drives7

Not supported

Redundant

Optical cable:

22°C (71.6°F)

Copper cable:

22°C (71.6°F)

1

The drive capacity must be less than 10 TB.

2

The drive capacity must be greater than or equal to 10 TB.

3

If the component is installed in server 1, and the server is installed in the

Apollo r2200 Gen10 Chassis

, drive blanks must be installed in drive bays 1-2 and 1-10. Similarly, if the component is installed in server 3, and the server is installed in the

Apollo r2200 Gen10 Chassis

, drive blanks must be installed in drive bays 3-2 and 3-10. For more information, see

Installing drive blanks and thermal bezel blanks for components with thermal limitations

.

4

If the component is installed in server 1 and the server is installed in the Apollo r2200 Gen10 Chassis, bezel blanks must be installed in drive bays 1-9, 1-10 and 1-11. If the component is installed in server 3 and the server is installed in the Apollo r2200 Gen10 Chassis, bezel blanks must be installed in drive bays 3-9, 3-10 and 3-11. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.

5

If the component is installed in server 1 and the server is installed in the Apollo r2600 Gen10 Chassis, bezel blanks must be installed in drive bays 1-9 to 1-14. If the component is installed in server 3 and the server is installed in the Apollo r2600 Gen10 Chassis, bezel blanks must be installed in drive bays 3-9 to 3-14. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.

6

If the component is installed in server 1 and the server is installed in the Apollo r2800 Gen10 Chassis, the drive blanks must be installed in drive bays 2-1 to 2-4. If the component is installed in server 3 and the server is installed in the Apollo r2800 Gen10 Chassis, the drive blanks must be installed in drive bays 4-1 to 4-4. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.

7

If the component is installed in server 1 and the server is installed in the Apollo r2800 Gen10 Chassis, bezel blanks must be installed in drive bays 1-3, 1-4, 2-1, 2-2, 2-3, and 2-4. If the component is installed in server 3 and the server is installed in the Apollo r2800 Gen10 Chassis, bezel blanks must be installed in drive bays 3-3, 3-4, 4-1, 4-2, 4-3 and 4-4. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.