Fibre Channel and Converged Network adapters
Description | Chassis | Fan configuration | Number of drives supported by the server | Maximum inlet ambient temperature |
---|---|---|---|---|
FC HBA | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | Not supported |
5 to 6 drives2 | Not supported | |||
0 to 4 drives3 | 28°C (82.4°F) | |||
Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | 28°C (82.4°F) | |
Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | 25°C (77°F) | |
Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | 28°C (82.4°F) | |
CNA | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | Optical cable: Not supported
Copper cable: 30°C (86°F) |
5 to 6 drives2 | Optical cable: Not supported
Copper cable: 28°C (82.4°F) |
|||
0 to 4 drives3 | Optical cable:
28°C (82.4°F) Copper cable: 35°C (95°F) |
|||
Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | Optical cable:
28°C (82.4°F) Copper cable: 35°C (95°F) |
|
Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | Optical cable:
25°C (77°F) Copper cable: 35°C (95°F) |
|
Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | Optical cable:
28°C (82.4°F) Copper cable: 35°C (95°F) |
The drive capacity must be less than 10 TB.
The drive capacity must be greater than or equal to 10 TB.
If the component is installed in server 1, and the server is installed in the
Apollo r2200 Gen10 Chassis, drive blanks must be installed in drive bays 1-2 and 1-10. Similarly, if the component is installed in server 3, and the server is installed in the
Apollo r2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 3-10. For more information, see
Installing drive blanks and thermal bezel blanks for components with thermal limitations.