Acronyms and abbreviations

3DS TSV: three-dimensional stacked through-silicon via (integrated circuit packaging technology)

AOC: active optical cable

BMC: baseboard management controller

CAS: column address strobe

CSR: customer self repair

DAC: direct attach cable

DACC: direct attach cooper cable

DDR4: double data rate-4

DHCP: dynamic host configuration protocol

EAC: EurAsian Conformity

EDR: enhanced data rate

EMI: electromagnetic interference

GPU: graphics processing unit

HPC: high performance computing

KVM: keyboard, video and mouse

LFF: large form factor

LRDIMM: load reduced dual in-line memory module

IPMI: Intelligent Platform Management Interface

MPI: Message Passing Interface

OCP: Open Compute Project

PCIe: Peripheral Component Interconnect Express

POST: Power-On Self-Test

QSFP: quad small form-factor pluggable

RDIMM: registered dual in-line memory module

REACH: Registration, Evaluation, Authorization, Restriction of Chemicals (European Union chemical regulatory framework)

RoHS: Restriction of Hazardous Substances

SATA: serial ATA

SFP: small form-factor pluggable

SFP+: enhanced small form-factor pluggable

SOL: serial over LAN

SSD: solid state device

SUV: serial, USB, video

TDP: thermal design power

TMRA: recommended ambient operating temperature

UART: universal asynchronous receiver / transmitter

UDIMM: unbuffered dual in-line memory module

UEFI: Unified Extensible Firmware Interface

UID: unit identification

UPS: uninterruptible power supply