Acronyms and abbreviations

3DS TSV: Three-dimensional stacked through-silicon via (integrated circuit packaging technology)

API: application program interface
CAS: column address strobe

CSR: Customer Self Repair

DDR4: double data rate-4

EAC: EurAsian Conformity

fsx: file system exerciser

HPE RSS: HPE Rapid Setup Software
HPE SSA: HPE Smart Storage Administrator
ISO: International Organization for Standardization
LFF: Large form factor
LRDIMM: load reduced dual in-line memory module
PCIe: Peripheral Component Interconnect Express
PDU: power distribution unit

POST: Power-On Self-Test
PSU: power supply unit
RDIMM: registered dual in-line memory module
RoHS: Restriction of Hazardous Substances

SATA: serial ATA
SSD: solid-state drive
TPM: Trusted Platform Module
TMRA: recommended ambient operating temperature
UDIMM: unregistered dual in-line memory module
UEFI: Unified Extensible Firmware Interface

UPS: uninterruptible power supply