Acronyms and abbreviations

3DS TSV: three-dimensional stacked through-silicon via (integrated circuit packaging technology)
API: application program interface

CAS: column address strobe
CSR: Customer Self Repair
DAC: direct attach cable

DDR4: double data rate-4
ESD: electrostatic discharge

HBA: host bus adapter
HPE SSA: HPE Smart Storage Administrator
ISO: International Organization for Standardization
KVM: keyboard, video, mouse
LFF: large form factor
LR: long reach
LRDIMM: load reduced dual in-line memory module
PCIe: Peripheral Component Interconnect Express

POST: Power-On Self-Test
RDIMM: registered dual in-line memory module
REACH: Registration, Evaluation, Authorization, Restriction of Chemicals (European Union chemical regulatory framework)
RoHS: Restriction of Hazardous Substances

SATA: serial ATA
SD: Secure Digital
SFP: small form-factor pluggable
SR: short range
SSD: solid-state drive
TPM: Trusted Platform Module
UDIMM: unregistered dual in-line memory module
UEFI: Unified Extensible Firmware Interface
UPS: uninterruptible power supply