Processors
The following limitations are for the Intel Xeon Gold 6244 (G6244) processor:
The processor does not support enhanced processor performance
LFF drives with drive capacities greater than or equal to 10 TB are not supported for the Apollo r2200 Gen10 Chassis series with three drives per node.
| Description | Chassis | Fan configuration | Number of drives supported by the server | Maximum inlet ambient temperature |
|---|---|---|---|---|
| Processor with a TDP of 135 W or more, except G6244 | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | 25°C (77°F) |
| 5 to 6 drives2 | Not supported |
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| 0 to 4 drives3 | 30°C (86°F) |
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| Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | 30°C (86°F) |
|
| Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | 30°C (86°F) |
|
| Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | 30°C (86°F) |
|
| Intel Xeon Gold 6244 (G6244) processor | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | Not supported |
| 5 to 6 drives2 | Not supported |
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| 0 to 4 drives3 | Not supported |
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| Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | Not supported |
|
| Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | Not supported |
|
| Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | Not supported |
|
| Processor with a TDP of between 125 W and 130 W | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | 25°C (77°F) |
| 5 to 6 drives2 | Not supported |
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| 0 to 4 drives3 | 30°C (86°F) |
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| Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | 30°C (86°F) |
|
| Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | 30°C (86°F) |
|
| Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | 30°C (86°F) |
|
| Processor with a TDP of between 100 W and 115 W | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | 30°C (86°F) |
| 5 to 6 drives2 | Not supported |
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| 0 to 4 drives3 | 35°C (95°F) |
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| Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | 35°C (95°F) |
|
| Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | 35°C (95°F) |
|
| Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | 35°C (95°F) |
The drive capacity must be less than 10 TB.
The drive capacity must be greater than or equal to 10 TB.
If the component is installed in server 1, and the server is installed in the Apollo r2200 Gen10 Chassis, drive blanks must be installed in drive bays 1-2 and 1-10. Similarly, if the component is installed in server 3, and the server is installed in the Apollo r2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 3-10. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.