Ethernet and InfiniBand adapters
Description | Chassis | Fan configuration | Number of drives supported by the server | Maximum inlet ambient temperature |
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Ethernet adapters with SFP+, SFP28 or QSFP transceivers/InfiniBand adapters with QDR or FDR speed | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | Optical cable: Not supported Copper cable: 25°C (77°F) |
5 to 6 drives2 | Not supported |
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0 to 4 drives3 | Optical cable: 22°C (71.6°F) Copper cable: 30°C (86°F) |
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Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | Optical cable: Not supported Copper cable: 30°C (86°F) |
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Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | Optical cable: Not supported Copper cable: 30°C (86°F) |
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Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | Optical cable: Not supported Copper cable: 30°C (86°F) |
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Ethernet adapters with QSFP28 transceiver/InfiniBand adapters with EDR speed | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | Optical cable: Not supported Copper cable: 25°C (77°F) |
5 to 6 drives2 | Not supported |
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0 to 4 drives3 | Optical cable: 22°C (71.6°F) Copper cable: 30°C (86°F) |
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Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | Optical cable: Not supported Copper cable: 30°C (86°F) |
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Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | Optical cable: Not supported Copper cable: 30°C (86°F) |
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Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | Optical cable: Not supported Copper cable: 30°C (86°F) |
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IB HDR100/EN 100 GB 1P 940QSFP56 | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | Not supported |
5 to 6 drives2 | Not supported |
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0 to 4 drives3 | Not supported |
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0 to 3 drives4 | Optical cable: 30°C (86°F) Copper cable: 35°C (95°F) |
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IB HDR100/EN 100 GB 1P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 0 to 3 drives4 | Optical cable: 28°C (82.4°F) Copper cable: 35°C (95°F) |
IB HDR100/EN 100 GB 1P 940QSFP56 | Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | Not supported |
0 to 6 drives5 | Optical cable: 25°C (77°F) Copper cable: 30°C (86°F) |
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IB HDR100/EN 100 GB 1P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) | Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 6 drives5 | Optical cable: 22°C (71.6°F) Copper cable: 30°C (86°F) |
IB HDR100/EN 100 GB 1P 940QSFP56 | Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | Not supported |
Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | Not supported |
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0 to 4 drives6 | Not supported |
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0 to 2 drives7 | Optical cable: 22°C (71.6°F) Copper cable: 25°C (77°F) |
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IB HDR100/EN 100 GB 2P 940QSFP56 | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | Not supported |
5 to 6 drives2 | Not supported |
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0 to 4 drives3 | Not supported |
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0 to 3 drives4 | Optical cable: 28°C (82.4°F) Copper cable: 35°C (95°F) |
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IB HDR100/EN 100 GB 2P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 0 to 3 drives4 | Optical cable: 25°C (77°F) Copper cable: 35°C (95°F) |
IB HDR100/EN 100 GB 2P 940QSFP56 | Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | Not supported |
0 to 6 drives5 | Optical cable: 22°C (71.6°F) Copper cable: 35°C (95°F) |
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IB HDR100/EN 100 GB 2P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) | Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 6 drives5 | Optical cable: 22°C (71.6°F) Copper cable: 30°C (86°F) |
IB HDR100/EN 100 GB 2P 940QSFP56 | Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | Not supported |
Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | Not supported |
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0 to 4 drives6 | Not supported |
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Nonredundant | 0 to 2 drives7 | Optical cable: Not supported Copper cable: 30°C (86°F) |
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Redundant | Optical cable: 22°C (71.6°F) Copper cable: 30°C (86°F) |
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IB HDR/EN 200 GB 1P 940QSFP56 | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 5 to 6 drives1 | Not supported |
5 to 6 drives2 | Not supported |
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0 to 4 drives3 | Not supported |
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0 to 3 drives4 | Optical cable: 28°C (82.4°F) Copper cable: 28°C (82.4°F) |
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IB HDR/EN 200 GB 1P 940QSFP56 (with RTX8000 GPU installed in three-slot secondary riser or FLOM riser) | Apollo r2200 Gen10 Chassis (12 LFF backplane) |
Redundant and nonredundant | 0 to 3 drives4 | Optical cable: 25°C (77°F) Copper cable: 25°C (77°F) |
IB HDR/EN 200 GB 1P 940QSFP56 | Apollo r2600 Gen10 Chassis (24 SFF or 16 SFF + 8 NVMe backplane) |
Redundant and nonredundant | 0 to 10 drives | Not supported |
0 to 6 drives5 | Not supported |
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Apollo r2800 Gen10 Chassis (24 SFF backplane with SAS expander) |
Redundant and nonredundant | 0 to 24 drives | Not supported |
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Apollo r2800 Gen10 Chassis (16 NVMe backplane) |
Redundant and nonredundant | 0 to 8 drives | Not supported |
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0 to 4 drives6 | Not supported |
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Nonredundant | 0 to 2 drives7 | Not supported |
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Redundant | Optical cable: 22°C (71.6°F) Copper cable: 22°C (71.6°F) |
The drive capacity must be less than 10 TB.
The drive capacity must be greater than or equal to 10 TB.
If the component is installed in server 1, and the server is installed in the
Apollo r2200 Gen10 Chassis, drive blanks must be installed in drive bays 1-2 and 1-10. Similarly, if the component is installed in server 3, and the server is installed in the
Apollo r2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 3-10. For more information, see
Installing drive blanks and thermal bezel blanks for components with thermal limitations.
If the component is installed in server 1 and the server is installed in the Apollo r2200 Gen10 Chassis, bezel blanks must be installed in drive bays 1-9, 1-10 and 1-11. If the component is installed in server 3 and the server is installed in the Apollo r2200 Gen10 Chassis, bezel blanks must be installed in drive bays 3-9, 3-10 and 3-11. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.
If the component is installed in server 1 and the server is installed in the Apollo r2600 Gen10 Chassis, bezel blanks must be installed in drive bays 1-9 to 1-14. If the component is installed in server 3 and the server is installed in the Apollo r2600 Gen10 Chassis, bezel blanks must be installed in drive bays 3-9 to 3-14. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.
If the component is installed in server 1 and the server is installed in the Apollo r2800 Gen10 Chassis, the drive blanks must be installed in drive bays 2-1 to 2-4. If the component is installed in server 3 and the server is installed in the Apollo r2800 Gen10 Chassis, the drive blanks must be installed in drive bays 4-1 to 4-4. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.
If the component is installed in server 1 and the server is installed in the Apollo r2800 Gen10 Chassis, bezel blanks must be installed in drive bays 1-3, 1-4, 2-1, 2-2, 2-3, and 2-4. If the component is installed in server 3 and the server is installed in the Apollo r2800 Gen10 Chassis, bezel blanks must be installed in drive bays 3-3, 3-4, 4-1, 4-2, 4-3 and 4-4. For more information, see Installing drive blanks and thermal bezel blanks for components with thermal limitations.