Acronyms and abbreviations

3DS TSV: three-dimensional stacked through-silicon via (integrated circuit packaging technology)

ADDDC: adaptive double device data correction

AHCI: advanced host controller interface

AHS: Active Health System

AHSV: Active Health System Viewer

API: application program interface

ASHRAE: American Society of Heating, Refrigerating and Air-Conditioning Engineers

CAS: column address strobe

CSA: Canadian Standards Association

CSR: customer self repair

DDR4: double data rate-4

GPU: graphics processing unit

HPE SSA: HPE Smart Storage Administrator

IEC: International Electrotechnical Commission

iLO: Integrated Lights-Out

IML: Integrated Management Log

ISO: International Organization for Standardization

iSUT: Integrated Smart Update Tools

LFF: large form factor

LRDIMM: load reduced dual in-line memory module

NMI: nonmaskable interrupt

PCA: printed circuit assembly

PCIe: Peripheral Component Interconnect Express

PDU: power distribution unit

POST: Power-On Self-Test

PXE: Preboot eXecution Environment

RAS: Reliability, Accessibility, Serviceability

RBSU: ROM-Based Setup Utility

RDIMM: registered dual in-line memory module

REST: representational state transfer

RoHS: Restriction of Hazardous Substances

RPS: redundant power supply

SD: secure digital

SAS: serial attached SCSI

SATA: serial ATA

SFF: small form factor

STK: scripting toolkit

StorCLI: Storage Command Line Interface

SPP: Service Pack for ProLiant

SSD: solid state drive

SUM: Smart Update Manager

TMRA: recommended ambient operating temperature

TPM: Trusted Platform Module

UDIMM: unregistered dual in-line memory module

UEFI: Unified Extensible Firmware Interface

UID: unit identification