Preparation procedures
To access some components and perform certain service procedures, you must perform one or more of the following procedures:
- Power down the system.
- Power down the node.
- Remove the node from the chassis.
- Remove the node blank from the chassis.
- Remove the power supply.
- Remove the chassis from the rack.
- Remove the security bezel.
- Remove the PDB cover.
- Remove the access panel.
- Remove the fan cages.
- Remove the chassis PDB assembly.
- Remove the rear I/O blank.
- Remove the air baffle.
- Remove the bayonet board assembly.
- Remove the PCI riser cage assembly.
- Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly.
- Remove Accelerator 1 from the three-slot riser cage assembly.
- Remove Accelerator 2 from the three-slot riser cage assembly.